Author:
Fried L. J.,Havas J.,Lechaton J. S.,Logan J. S.,Paal G.,Totta P. A.
Cited by
57 articles.
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1. Packaging Assembly Techniques;Handbook of Fiber Optic Data Communication;2008
2. Chip Integration;Handbook of Semiconductor Interconnection Technology, Second Edition;2006-02-22
3. Metallization;Handbook of Semiconductor Interconnection Technology, Second Edition;2006-02-22
4. Fluxless fabrications of Sn-Au solder microbumps by a hydrogen plasma reflow technique;Journal of Electronic Materials;2005-05
5. Novel micro-bump fabrication for flip-chip bonding;Journal of Electronic Materials;2004-11