1. New matrix algorithm for calculating diagonally matched impedance of packaging interconnecting lines;IEEE Transactions on Microwave Theory and Techniques;1999-06
2. Semiconductor Manufacturing;Electrical Engineering Handbook;1997-09-26
3. Crosstalk estimate for CMOS-terminated RLC interconnections;IEEE Transactions on Circuits and Systems I: Fundamental Theory and Applications;1997
4. Printed-Wiring Board Packaging;Microelectronics Packaging Handbook;1997
5. Fast coupled noise estimation for crosstalk avoidance in the MCG multichip module autorouter;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;1996-09