Systems research challenges: A scale-out perspective
Author:
Publisher
IBM
Subject
General Computer Science
Link
http://xplorestaging.ieee.org/ielx5/5288520/5388720/05388721.pdf?arnumber=5388721
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Design and Fabrication of a Silicon Interposer With TSVs in Cavities for Three-Dimensional IC Packaging;IEEE Transactions on Device and Materials Reliability;2012-06
2. High-bandwidth, chip-based optical interconnects on waveguide-integrated SLC for optical off-chip I/O;2009 59th Electronic Components and Technology Conference;2009-05
3. Low-Power, High-Bandwidth Optical Interconnects for Computing Systems;Asia Communications and Photonics Conference and Exhibition;2009
4. Three-dimensional silicon integration;IBM Journal of Research and Development;2008-11
5. 3D silicon integration;2008 58th Electronic Components and Technology Conference;2008-05
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