Prenucleation of Lead Films with Copper, Gold, and Silver
Author:
Publisher
IBM
Subject
General Computer Science
Link
http://xplorestaging.ieee.org/ielx5/5288520/5392253/05392256.pdf?arnumber=5392256
Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Fabrication technology for lead‐alloy Josephson devices for high‐density integrated circuits;Journal of Applied Physics;1986-03
2. The Au−Pb (Gold−Lead) system;Bulletin of Alloy Phase Diagrams;1984-06
3. Preparation of Pb–Bi film by alloy evaporation II. Microstructure and morphology;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;1983-07
4. Reducing the grain size of polycrystalline lead films by the use of nucleants;Journal of Applied Physics;1982-07
5. Thermal stability of Pb‐alloy Josephson junction electrode materials. III. Correlation of microstructure and strain in Pb‐In‐Au base electrodes;Journal of Applied Physics;1982-01
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