Land grid array sockets for server applications
Author:
Publisher
IBM
Subject
General Computer Science
Link
http://xplorestaging.ieee.org/ielx5/5288520/5388961/05388965.pdf?arnumber=5388965
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4. Multiphysics Analysis and Optimal Design of Compressible Micro-Interconnect for 2.5D/3D Heterogeneous Integration;Electronics;2021-09-12
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