Sensor Systems for Extremely Harsh Environments

Author:

Kappert Holger1,Schopferer Sebastian2,Saeidi Nooshin3,Döring Ralf4,Ziesche Steffen5,Olowinsky Alexander6,Naumann Falk7,Jägle Martin8,Spanier Malte9,Grabmaier Anton10

Affiliation:

1. Fraunhofer Institute for Microelectronic Circuits and Systems IMS, Finkenstr

2. 2Fraunhofer Institute for High-Speed Dynamics, Ernst-Mach-Institut, EMI

3. Fraunhofer Institute for Electronic Nano Systems ENAS

4. 3Fraunhofer Institute for Electronic Nano Systems ENAS

5. 4Fraunhofer Institute for Ceramic Technologies and Systems IKTS

6. Fraunhofer Institute for Laser Technology ILT

7. Fraunhofer Institute for Microstructure of Materials and Systems IMWS

8. Fraunhofer Institute for Physical Measurement Techniques IPM

9. Fraunhofer Institute for Reliability and Microintegration IZM

10. Fraunhofer Institute for Microelectronic Circuits and Systems IMS

Abstract

Sensors are key elements for capturing environmental properties and are today indispensable in the industry for monitoring and control of industrial processes. Many applications are demanding for highly integrated intelligent sensors to meet the requirements on safety, clean, and energy-efficient operation, or to gain process information in the context of industry 4.0. While in many everyday objects highly integrated sensor systems are already state of the art, the situation in an industrial environment is clearly different. Frequently, the use of sensor systems is impossible due to the fact that the extreme ambient conditions of industrial processes like high operating temperatures or strong mechanical loads do not allow a reliable operation of sensitive electronic components. Eight Fraunhofer Institutes have bundled their competencies and have run the Fraunhofer Lighthouse Project “eHarsh” to overcome this situation. The project goal was to realize sensor systems for extremely harsh environments, whereby sensor systems are more than pure sensors, rather these are containing one or multiple sensing elements and integrated readout electronics. Various technologies, which are necessary for the realization of such sensor systems, have been identified, developed, and finally bundled in a technology platform. These technologies are, e.g., MEMS and ceramic-based sensors, SOI-CMOS-based integrated electronics, board assembly and laser-based joining technologies. All these developments have been accompanied by comprehensive tests, material characterization, and reliability simulations. Based on the platform, a pressure sensor for turbine applications has been realized to prove the performance of the eHarsh technology platform.

Publisher

IMAPS - International Microelectronics Assembly and Packaging Society

Subject

Electrical and Electronic Engineering,Computer Networks and Communications,Electronic, Optical and Magnetic Materials

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. PCB Embedding Technology for the Miniaturization of complex electronic systems;2022 IEEE CPMT Symposium Japan (ICSJ);2022-11-09

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3