Author:
Reddy Vishnu V. B.,Williamson Jaimal,Sitaraman Suresh K.
Abstract
Abstract
Laser ultrasonic inspection is a novel, noncontact, and nondestructive technique to evaluate the quality of solder interconnections in microelectronic packages. In this technique, identification of defects or failures in solder interconnections is performed by comparing the out-of-plane displacement signals, which are produced from the propagation of ultrasonic waves, from a known good reference sample and sample under test. The laboratory-scale dual-fiber array laser ultrasonic inspection system has successfully demonstrated identifying the defects and failures in the solder interconnections in advanced microelectronic packages such as chip-scale packages, plastic ball grid array packages, and flip-chip ball grid array packages. However, the success of any metrology system depends upon precise and accurate data to be useful in the microelectronic industry. This paper has demonstrated the measurement capability of the dual-fiber array laser ultrasonic inspection system using gage repeatability and reproducibility analysis. Industrial flip-chip ball grid array packages have been used for conducting experiments using the laser ultrasonic inspection system and the inspection data are used to perform repeatability and reproducibility analysis. Gage repeatability and reproducibility studies have also been used to choose a known good reference sample for comparing the samples under test.
Publisher
IMAPS - International Microelectronics Assembly and Packaging Society
Subject
Electrical and Electronic Engineering,Computer Networks and Communications,Electronic, Optical and Magnetic Materials
Reference12 articles.
1. “An overview of non-destructive testing methods for integrated circuit packaging inspection,”;Aryan;Sensors (Basel),2018
2. “Evaluation of FCBGA package subjected to four-point bend reliability test using fiber array laser ultrasonic inspection system,”;Reddy;IEEE Transactions on Components, Packaging, and Manufacturing Technology
3. “Assessment of 2nd level interconnect quality in Flip Chip Ball Grid Array (FCBGA) package using laser ultrasonic inspection technique,”;Reddy;Journal of SMT
4. “Non-destructive failure analysis of various chip to package interaction anomalies in FCBGA packages subjected to temperature cycle reliability testing,”;Reddy
5. “Feasibility studies and advantages of using dual fiber array in laser ultrasonic inspection of electronic chip packages,”;Mebane;IEEE Transactions on Components, Packaging, and Manufacturing Technology