Finite Element Modeling of Rigid-Flex PCBs for Dynamic Environments

Author:

Bell John1,Redmond Laura23,Carpenter Kalind4,de la Croix Jean-Pierre5

Affiliation:

1. Glenn Department of Civil Engineering, Clemson University, South Palmetto Boulevard, Clemson, South Carolina 29631

2. Glenn Department of Civil Engineering, Department of Mechanical Engineering, Clemson University, South Palmetto Boulevard, Clemson, South Carolina 29631

3. NASA Jet Propulsion Laboratory, California Institute of Technology, 4800 Oak Grove Drive, Pasadena, California 91109

4. Robotic Vehicles and Manipulators Group, NASA Jet Propulsion Laboratory California, Institute of Technology, 4800 Oak Grove Drive, Pasadena, California 91109

5. Maritime and Multi-Agent Autonomy, NASA Jet Propulsion Laboratory, California Institute of Technology, 4800 Oak Grove Drive, Pasadena, California 91109

Abstract

ABSTRACT Rigid-flex circuit boards are becoming more prevalent as the limits are pushed on the size, mass, and geometry of electronic systems. A key aspect of designing a rigid-flex printed circuit boards (PCB) system is an assessment of the dynamic properties of the PCB and predicting system performance under dynamic loading. Among current modeling methodologies for rigid-flex PCB, a simplified modeling methodology that adequately captures the system dynamics does not exist. This article presents a novel, computationally efficient approach for modeling rigid-flex PCB systems and the calibration of the material models via modal testing. The resulting simplified model is able to capture system frequencies, mode shapes, and representative force-displacement behavior. The proposed methodology is used to model NASA Jet Propulsion Laboratory’s Pop-Up Flat Folding Explorer Robot (PUFFER) and assess the sensitivity of a system model to input parameters.

Publisher

IMAPS - International Microelectronics Assembly and Packaging Society

Subject

Electrical and Electronic Engineering,Computer Networks and Communications,Electronic, Optical and Magnetic Materials

Reference32 articles.

1. “Fabrication and reliability of rigid-flexible optical electrical printed circuit board for mobile devices,”;Rho;IEEE Photonics Technology Letters,2008

2. “New materials and build-up constructions for advanced rigid-flex PCB applications,”;Rapala-Virtanen;Circuit World,2005

3. “Pop-up mars rover with textile-enhanced rigid-flex PCB body,”;Karras,2017

4. Perez M., “Origami-inspired robot can hitch a ride with a rover,” https://www.nasa.gov/feature/jpl/origami-inspired-robot-can-hitch-a-ride-with-a-rover, May 14, 2020, March 20, 2017.

5. “Origami folding: a structural engineering approach,”;Schenk,2011

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