Co-Design and Demonstration of a Fully Integrated Optical Transceiver Package Featuring Optical, Electrical, and Thermal Interconnects in Glass Substrate

Abstract

Abstract This paper presents the design and demonstration of a glass package that emulates a 400 Gbps optical transceiver module. The co-design methodology ensures that requirements for optical, electrical, and thermal interconnects are met. It terms of optics, the integrated turning structure demonstrated last year is refined to reduce coupling loss to <3 dB without adding significant process complexity. 28 Gbps high speed electrical interconnects are fabricated directly on glass for insertion loss < 0.1 dB/mm. Thermal management is enabled by the use of thermal vias, which can modify the equivalent thermal conductivity of glass substrate to provide local heat sinking capability. The integrated design is fabricated utilizing a panel scalable process flow developed by the authors with shared steps. Initial characterization results confirms the electrical performance and the quality of optical turning structures.