Experimental Evaluation of Glob-top Materials for use in Harsh Environments

Author:

Lindgren Mats12,Belov Ilja2,Leisner Peter2

Affiliation:

1. 1Kitron AB, P.O. Box 1053, SE 551 10 Jönköping, Sweden, Ph: +46 36 559 40 84; Fax: +46 36 17 56 40 Email:mats.lindgren@kitron.com

2. 2School of Engineering Jönköping University and Acreo AB, P.O. Box 1026, SE 551 11 Jönköping, Sweden

Abstract

This article presents results of experimental evaluation of glob-top materials for multi-chip-modules (MCM) in harsh environments. Material and process tests have been performed with the purpose to find a material which would fulfill the reliability requirements for use e.g. in military or automotive applications. Seven polymer materials, i.e. four epoxies, two silicones and one polyurethane material have been selected and evaluated in the experiments. The most critical material and process parameters for glob-top have been identified and measured. Based on the experimental results, application-based scoring of studied epoxy materials has been performed. Material evaluation results have been summarized in conclusions about the most suitable glob-top material for use in harsh environments.

Publisher

IMAPS - International Microelectronics Assembly and Packaging Society

Subject

Electrical and Electronic Engineering,Computer Networks and Communications,Electronic, Optical and Magnetic Materials

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Technological Process of Assembly and QA Testing of Silicone Tracking Modules with Silicon Strip Sensor;Physics of Particles and Nuclei Letters;2024-06

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3. Direct media exposure of MEMS multi-sensor systems using a potted-tube packaging concept;Sensors and Actuators A: Physical;2008-03

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