Do credit market accessibility and legal protection shape corporate innovation?-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Do credit market accessibility and legal protection shape corporate innovation?

Published:2022-08-02 Issue:3 Volume:45 Page:719-754
ISSN:0270-2592
Container-title:Journal of Financial Research
language:en
Short-container-title:J of Financial Research

Author:

Shen Danlin¹,Chen Carl R.²^ORCID,Yan Xinyan²^ORCID,Yi Zhihong³

Affiliation:

1. Department of Accounting, School of Management China University of Mining & Technology (Beijing) Beijing China

2. Department of Economics and Finance University of Dayton Dayton Ohio USA

3. Department of Finance, Renmin Business School Renmin University of China Beijing China

Funder

Fundamental Research Funds for the Central Universities

National Natural Science Foundation of China

Publisher

Wiley

Subject

Finance,Accounting

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1111/jfir.12297

Reference64 articles.

1. Information Asymmetry, R&D, and Insider Gains

2. State Capacity and Economic Development: A Network Approach

3. Labor Laws and Innovation

4. Bankruptcy Codes and Innovation

5. Distance and Private Information in Lending

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Complex Business Environment Systems and Corporate Innovation;Systems;2024-09-11

2. Interregional circulation of credit resources and company innovation;PLOS ONE;2024-08-20

3. Incentives Innovation in Listed Companies: Empirical Evidence from China's Economic Value-Added Reform;2024

4. How Does Digital Transformation Affect Corporate Innovation? Evidence from Chinese Listed Corporations;2023

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3