Heat shock protein 105 is overexpressed in squamous cell carcinoma and extramammary Paget disease but not in basal cell carcinoma
Author:
Publisher
Wiley
Subject
Dermatology
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1111/j.1365-2133.2006.07362.x/fullpdf
Reference18 articles.
1. Characterization of high molecular mass heat shock proteins and 42 °C-specific heat shock proteins of murine cells;Hatayama;Biochem Biophys Res Commun,1994
2. Heat shock proteins and the skin;Morris;Exp Dermatol,2001
3. Induction of Apg-1, a member of the heat shock protein 110 family, following transient forebrain ischaemia in the rat brain;Xue;Biochem Biophys Res Commun,1998
4. Germ specific heat shock protein 105 binds to p53 in a temperature-sensitive manner in rat testis;Kumagai;Eur J Biochem,2000
5. Cloning and expression of murine high molecular mass heat shock proteins, HSP105;Yasuda;J Biol Chem,1995
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