Hsp70 and small Hsps are the major heat shock protein members involved in midgut metamorphosis in the common cutworm, Spodoptera litura
Author:
Publisher
Wiley
Subject
Insect Science,Genetics,Molecular Biology
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1111/j.1365-2583.2012.01158.x/fullpdf
Reference59 articles.
1. Suppression of ceramide-mediated apoptosis by HSP70;Ahn;Mol Cell,1999
2. Structural features critical to the activity of an ecdysone receptor binding site;Antoniewski;Insect Biochem Mol Biol,1993
3. Steroid regulation of programmed cell death during Drosophila development;Baehrecke;Cell Death Differ,2000
4. The control of the false discovery rate in multiple testing under dependency;Benjamini;Ann Stat,2001
5. Small heat shock proteins in Drosophila confer thermal tolerance;Berger;Exp Cell Res,1983
Cited by 57 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Identification of HSP70 genes in Diaphorina citri Kuwayama Reveals Their Involvement in Immunity and Development;Molecular Biotechnology;2024-06-28
2. Unveiling Molecular Effects of the Secondary Metabolite 2-Dodecanone in the Model Hymenopteran Nasonia vitripennis;Toxics;2024-02-18
3. Genome-wide analysis and characterization of HSP gene families (HSP20, HSP40, HSP60, HSP70, HSP90) in the yellow fever mosquito (Aedes aegypti) (Diptera: Culicidae);Journal of Insect Science;2023-11-01
4. A transcriptomic investigation of heat-induced transgenerational plasticity in beetles;Biological Journal of the Linnean Society;2023-02-27
5. A heat shock protein 70 protects the green peach aphid (Myzus persicae) against high-temperature stress;Journal of Asia-Pacific Entomology;2022-12
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3