Bond Strength and Interfacial Micromorphology of Etch-and-Rinse and Self-Adhesive Resin Cements to Dentin
Author:
Publisher
Wiley
Subject
General Dentistry
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1111/j.1532-849X.2011.00794.x/fullpdf
Reference38 articles.
1. Effect of curing protocol on the polymerization of dual-cured resin cements;Pereira;Dent Mater,2010
2. Long-term bond between dual-polymerizing cementing agents and human hard dental tissue;Piwowarczyk;Dent Mater,2007
3. A study of the physical and chemical properties of four resin composite luting cements;Kumbuloglu;Int J Prosthodont,2004
4. Mechanical and physical properties of contemporary dental luting agents;Attar;J Prosthet Dent,2003
5. Human pulp response to resin cements used to bond inlay restorations;Costa;Dent Mater,2006
Cited by 45 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Bond strength to dentin of a Polymer-infiltrate ceramic-network material cemented with dual resin cements submitted to different adhesive strategies;International Journal of Adhesion and Adhesives;2024-01
2. Changes in Strength Parameters of Composite Cements as Affected by Storage Temperature—A Review of the Literature;Coatings;2023-01-20
3. Physicochemical Properties of Dentine Subjected to Microabrasive Blasting and Its Influence on Bonding to Self-Adhesive Prosthetic Cement in Shear Bond Strength Test: An In Vitro Study;Materials;2022-02-16
4. Shear bond strength of resin bonded zirconia and lithium disilicate – effect of surface treatment of ceramics and dentin;Biomaterial Investigations in Dentistry;2022-02-16
5. Cement selection criteria for different types of intracanal posts;Dental Research Journal;2022
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3