A Cu-Pd-V System Filler Alloy for Silicon Nitride Ceramic Joining and the Interfacial Reactions

Author:

Xiong Hua-Ping1,Chen Bo1,Pan Yu2,Zhao Hai-Sheng1,Mao Wei1,Cheng Yao-Yong1

Affiliation:

1. Lab. of Welding and Forging; Beijing Institute of Aeronautical Materials; Beijing 100095 China

2. Science and Technology on Scramjet Laboratory; National University of Defense Technology; Hunan Changsha 410073 China

Funder

National Natural Science Foundation of China

Aeronautical Science Foundation of China

Opening Foundation of Science and Technology on Scramjet Laboratory

National University of Defense Technology

Publisher

Wiley

Subject

Materials Chemistry,Ceramics and Composites

Reference41 articles.

1. Brazing of Silicon Carbide to Stainless Steel;Iseki;Am. Cream. Soc. Bull,1985

2. A Review on Joining Non-Oxide Ceramics to Metals;Martinelli;J. Can. Ceram. Soc.,1997

3. Interfacial Characteristics for Active Brazing of Alumina to Superalloys;Weng;J. Adv. Mater.,1997

4. Oxidation Behavior of Silver- and Copper-Based Brazing Filler Metals for Silicon Nitride/Metal Joints;Kapoor;J. Am. Ceram. Soc.,1989

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