A Lead-Free and High-Energy Density Ceramic for Energy Storage Applications-Reference-Cited by-同舟云学术

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A Lead-Free and High-Energy Density Ceramic for Energy Storage Applications

Published:2013-08-19 Issue:9 Volume:96 Page:2699-2702
ISSN:0002-7820
Container-title:Journal of the American Ceramic Society
language:en
Short-container-title:J. Am. Ceram. Soc.

Author:

Correia Tatiana M.¹,McMillen Mark²,Rokosz Maciej K.¹,Weaver Paul M.¹,Gregg John M.²,Viola Giuseppe³⁴,Cain Markys G²

Affiliation:

1. National Physical Laboratory; Hampton Road Teddington Middlesex TW11 0LW United Kingdom

2. Centre for Nanostructured Media; School of Maths and Physics; Queen's University Belfast; Belfast BT7 1NN Northern Ireland United Kingdom

3. School of Engineering and Materials Science; Queen Mary University of London; Mile End Road London E1 4NS United Kingdom

4. Nanoforce Technology Ltd; Queen Mary University of London; Mile End Road London E1 4NS United Kingdom

Funder

UK's National Measurement Office

Technology Strategy Board

Publisher

Wiley

Subject

Materials Chemistry,Ceramics and Composites

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1111/jace.12508/fullpdf

Reference15 articles.

1. Nonlinear Dielectric Ceramics and Their Applications to Capacitors and Tunable Dielectrics;Kwon;IEEE Electr. Insul. Mag.,2011

2. Nonlinear Dielectric Thin Films for High-Power Electric Storage with Energy Density Comparable with Electrochemical Supercapacitors;Yao;IEEE Trans. Ultrason. Ferroelectr. Freq. Control,2011

3. A Dielectric Polymer with High Electric Energy Density and Fast Discharge Speed;Chu;Science,2006

4. J. P. Dougherty Cardiac Defibrillator with High Energy Storage Antiferroelectric Capacitor 1996

5. Large Strain and High Energy Storage Density in Orthorhombic Perovskite (Pb0.97La0.02)(Zr1−x−ySnxTiy)O3 Antiferroelectric Thin Films;Mirshekarloo;Appl. Phys. Lett.,2010

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1. High Energy Density Achieved in Novel Lead-Free BiFeO₃–CaTiO₃ Ferroelectric Ceramics for High-Temperature Energy Storage Applications;ACS Applied Materials & Interfaces;2024-01-11

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