In vitrobond strength of cements to treated teeth
Author:
Publisher
Wiley
Subject
General Dentistry
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1111/j.1834-7819.1986.tb01243.x/fullpdf
Reference14 articles.
1. A simple method of increasing the adhesion of acrylic filling materials to enamel surfaces;Buonocore;J Dent Res,1955
2. Improvement in the adhesion of polyacrylate cements to human dentine;Beech;Br Dent J,1973
3. The bonding of glass ionomer cements to metal and tooth substrates;Hotz;Br Dent J,1977
4. Epoxy resins for bonding orthodontic attachments to teeth;Retief;J Dent Assoc S Afr,1967
5. Bonding of resins to phosphoric acid-etched enamel surfaces of permanent and deciduous teeth;Sheykholeslam;J Dent Res,1972
Cited by 41 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Effect of Different Decontamination Protocols Applied to Blood-Saliva Contaminated Dentin Surfaces of Universal Adhesive Resin Post-Etch on Shear Bond Strength;Ozone: Science & Engineering;2022-12-26
2. Effects of blood contamination and hemostatic agents on bond strength in primary teeth dentin;Nigerian Journal of Clinical Practice;2020
3. Mycobacterial protein tyrosine kinase, PtkA phosphorylates PtpA at tyrosine residues and the mechanism is stalled by the novel series of inhibitors;Journal of Drug Targeting;2018-05-21
4. Effect of decontamination on micro-shear bond strength of silorane-based composite increments;Journal of Investigative and Clinical Dentistry;2015-11-05
5. Resin–resin microtensile bond strength after different surface treatments to clean blood contamination;Revista Portuguesa de Estomatologia, Medicina Dentária e Cirurgia Maxilofacial;2015-10
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3