Evaluation of low bone mass and prediction of fracture risk using metacarpal radiogrammetry method: a comparative study with DXA and X-ray phantom
Author:
Affiliation:
1. Department of Biomedical Engineering; SRM Institute of Science and Technology; Chennai Tamil Nadu India
2. Andhra Pradesh Medtech Zone (AMTZ); Visakhapatnam India
Publisher
Wiley
Subject
Rheumatology
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1111/1756-185X.13326/fullpdf
Reference53 articles.
1. The Asian audit: epidemiology, costs and burden of osteoporosis in Asia;Mithal;Int Osteoporos Foundation,2009
2. Geographic variation in osteoporotic hip fracture incidence: the growing importance of Asian influences in coming decades;Dhanwal;J Osteoporosis,2010
3. Epidemiology and treatment of osteoporosis in women: an Indian perspective;Khadilkar;Int J Womens Health,2015
4. Das Ergebnispapier der, consensus development conference uber diagnose, prophylaxe und behandlung der osteoporose;Keck;Osteologie,1993
5. An estimate of the world wide prevalence and disability associated with osteoporotic fractures;Johnell;Osteoporos Int,2006
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