Approach on Thermal Strain Behaviour of PBGA Solder Joints
Author:
Publisher
Wiley
Subject
Mechanical Engineering,Mechanics of Materials
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1111/j.1475-1305.2008.00523.x/fullpdf
Reference8 articles.
1. Experimental and numerical investigation of mechanical and thermal residual strains in adhesively bonded joints;Jumbo;Strain,2007
2. Research on parametric analysis for stress of PBGA solder joint under shock load;Yang;Int. J. Mater. Product Technol.,2008
3. Physical mechanism of interfacial thermal resistance in electronic packaging based on a mixed MD/FE model;Yang;IEEE Trans. Adv. Packaging,2008
4. Surface sliding simulation in micro gear train for adhesion problem and tribology design by using molecular dynamics model;Yang;Comput. Mater. Sci.,2007
5. Characterizations of friction force and sliding velocity in nano-scale interfacial friction;Liao;Int. J. Mater. Struct. Intergrity,2007
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1. Multiscale Investigation on Interfacial Properties of Cu/Al Structures in Electronic Packaging;Applied Mechanics and Materials;2013-11
2. Comparison approach on strain behavior of PBGA assembly by considering different thermal‐mechanical compound loading modes;Microelectronics International;2012-05-04
3. Testing on dynamic behavior of PBGA assembly by considering fixed‐modes;Microelectronics International;2011-05-10
4. Material property effects on solder failure analyses;Microelectronics Reliability;2011-05
5. Viscoelastic properties effect on solder ball failure analyses;2010 12th Electronics Packaging Technology Conference;2010-12
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