Failure mechanism of HR3C austenitic steel during creep at 650°C

Author:

Wang Xiao1ORCID,Wan Xiaofeng1,Liu Yu1,Zhu Yu1,Zhang Fubao1,Lv Shuaishuai1,Zhang Yuetao2,Du Zechen3ORCID

Affiliation:

1. School of Mechanical Engineering Nantong University Nantong China

2. CHN ENERGY BOILER AND PRESSURE VESSEL INSPECTON CO., LTD. Beijing China

3. School of Civil and Resource Engineering University of Science and Technology Beijing Beijing China

Abstract

AbstractThis paper investigates the intergranular failure and degradation process of HR3C steel during creep. Substantial microscopic information for the morphological and compositional characteristics of intergranular precipitates were revealed here. The results showed that the intergranular M23C6 carbides precipitated progressively, resulting in a formation of Cr‐depleted region, and coexist with the NbCrN phase at the grain boundary. Besides, the dislocation configuration and density of HR3C steel also changed remarkably after creep, which manifests that the increase of lattice debonding extent and irregular atoms array. The intergranular damage of the M23C6 matrix interface was revealed by the HRTEM observation, and the main damage features were the volumetric defect generation as well as the large‐area distortion of atom lattice around the M23C6, which would contribute to the intergranular crack forming at the end of creep stage.

Funder

Guangdong Provincial Applied Science and Technology Research and Development Program

Nantong University

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3