Effect of microstructures on dielectric breakdown strength of sintered reaction‐bonded silicon nitride ceramics
Author:
Affiliation:
1. National Institute of Advanced Industrial Science and Technology (AIST) Nagoya Japan
2. Japan Fine Ceramics Co. Ltd. Sendai Japan
Publisher
Wiley
Subject
Materials Chemistry,Ceramics and Composites
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1111/jace.18826
Reference41 articles.
1. High-temperature electro-ceramics and their application to SiC power modules
2. Thermal ratchetting effect of AMB-AlN ceramic substrate: Experiments and calculations
3. Effect of high temperature cycling on both crack formation in ceramics and delamination of copper layers in silicon nitride active metal brazing substrates
4. Effects of microstructure and intergranular glassy phases on thermal conductivity of silicon nitride
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