Low-Temperature Sintering and Microwave Dielectric Properties of (Mg0.95 Zn0.05 )2 (Ti0.8 Sn0.2 )O4 -(Ca0.8 Sr0.2 )TiO3 Composite Ceramics-Reference-Cited by-同舟云学术

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Low-Temperature Sintering and Microwave Dielectric Properties of (Mg0.95 Zn0.05 )2 (Ti0.8 Sn0.2 )O4 -(Ca0.8 Sr0.2 )TiO3 Composite Ceramics

Published:2013-06-12 Issue:10 Volume:96 Page:3114-3119
ISSN:0002-7820
Container-title:Journal of the American Ceramic Society
language:en
Short-container-title:J. Am. Ceram. Soc.

Author:

Yao Guoguang¹²,Liu Peng¹,Zhang Huaiwu³

Affiliation:

1. College of Physics and Information Technology; Shaanxi Normal University; Xi'an 710062 China

2. School of Science; Xi'an University of Posts and Telecommunications; Xi'an 710121 China

3. The Key Laboratory of Electronic Thin Film and Integrated Device; University of Electronic Science and Technology of China; Chengdu 610054 China

Funder

National Natural Science Foundation of China

Open Fund of State Key Laboratory of Electronic Thin Films and Integrated Devices

Publisher

Wiley

Subject

Materials Chemistry,Ceramics and Composites

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1111/jace.12432/fullpdf

Reference34 articles.

1. Synthesis and Microwave Dielectric Properties of Zn3B2O6 Ceramics for Substrate Application;Wu;J. Am. Ceram. Soc.,2012

2. Formation and Microwave Dielectric Properties of the Mg2V2O7 Ceramics;Joung;J. Am. Ceram. Soc.,2009

3. Ferroelastic Phase Transition Compositional Dependence for Solid-Solution [(Li0.5Bi0.5)xBi1−x][MoxV1−x]O4 Scheelite-Structured Microwave Dielectric Ceramics;Zhou;Acta Mater.,2011

4. Structure and Electrical Properties of Mg2TiO4;Kumar;J. Ceram. Soc. Jpn.,2009

5. High-Q Microwave Dielectric Materials Based on the Spinel Mg2TiO4;Belous;J. Am. Ceram. Soc.,2006

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4. Low-temperature sintering and magnetic properties of MABS glass doped Li0.35Zn0.30Mn0.05Ti0.1Fe2.05O4 ferrites;Journal of Alloys and Compounds;2018-10

5. Low-firing Li0.42Zn0.27Ti0.11Mn0.1Fe2.1O4 ceramics modified with V2O5–ZnO–B2O3 glass addition for microwave device application;Journal of Materials Science: Materials in Electronics;2018-01-19

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