Research on rice grain damage behavior with experimental and finite element modeling

Author:

Yang Liu1ORCID,Luo Yang1,Xiao Xuan1,Li Yu1,Zhao Junhua2,Pei Houchang13,Song Shaoyun13,Zhang Yonglin13

Affiliation:

1. College of Mechanical Engineering Wuhan Polytechnic University Wuhan Hubei China

2. Hubei Cereals and Oils Machinery Engineering Center Wuhan China

3. School of Animal Science and Nutritional Engineering Wuhan Polytechnic University Wuhan Hubei China

Abstract

AbstractUnderstanding the rice grain breakage mechanism is important to increase head rice yield. In this work, a developed mechanical experimental setup is produced, combing a texture analyzer with in situ observation. Grain damage behavior was researched with experimental and finite element modeling. Experimental results showed rice breaking force is closely related to pressing speed and rice length. Three models simulation (ellipsoidal model E model, three section model T model, real shape model R model) results show that the E model is not suitable for quasi‐static compression simulation, the peak force is 35.897% error with testing. T and R modeling results error is within 10%, the broken form is closely related to the dorsal groove and ridge. Initial cracks exit in the area close to the probe and expand inward. Surface cracks happen when element stress exceeds the tensile strength. These findings provide a theoretical basis for broken rice rate reduction during processing.

Funder

Natural Science Foundation of Hubei Province

Publisher

Wiley

Subject

General Chemical Engineering,Food Science

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3