ZrSi 2 –MgO as novel additives for high thermal conductivity of β‐Si 3 N 4 ceramics

Author:

Wang Weide12ORCID,Yao Dongxu1,Chen Huanbei3,Xia Yongfeng1,Zuo Kaihui1,Yin Jinwei1ORCID,Liang Hanqin1ORCID,Zeng Yu‐Ping1ORCID

Affiliation:

1. State Key Laboratory of High Performance Ceramics and Superfine Microstructure Shanghai Institute of Ceramics Chinese Academy of Sciences Shanghai China

2. Center of Materials Science and Optoelectronics Engineering University of Chinese Academy of Sciences Beijing China

3. Nanjing Electronic Devices Institute Nanjing China

Funder

Youth Innovation Promotion Association of the Chinese Academy of Sciences

Publisher

Wiley

Subject

Materials Chemistry,Ceramics and Composites

Reference55 articles.

1. NishimuraT MimuraK YamamotoK IdakaS ShinoharaT.High heat dissipation and high heat durability technologies for transfer‐molded power modules with insulating sheets. CIPS 2016–9th International Conference on Integrated Power Electronics Systems.Nuremberg 2016; p.1–5.

2. Thermal Issues in Next-Generation Integrated Circuits

3. MiyazakiH IwakiriS HirotsuruH FukudaS HiraoK HyugaH.Effect of mechanical properties of the ceramic substrate on the thermal fatigue of Cu metallized ceramic substrates. IEEE 18th Electronics Packaging Technology Conference (EPTC).Singapore 2016; p.268–70.

4. Silicon Nitride and Related Materials

5. Microstructural Design of Toughened Ceramics

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