Damage and failure mechanism of sapphire under ballistic loading based on a modified bond‐based peridynamic model
Author:
Affiliation:
1. State Key Laboratory of Subtropical Building Science South China University of Technology Guangzhou Guangdong
2. Department of Engineering Mechanics South China University of Technology Guangzhou Guangdong
Funder
Natural Science Foundation of Guangdong Province
National Natural Science Foundation of China
Publisher
Wiley
Subject
Materials Chemistry,Ceramics and Composites
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1111/jace.18904
Reference73 articles.
1. Ballistic testing of transparent armour ceramics
2. Transparent ceramic and glass-ceramic materials for armor applications
3. The effect of anisotropy on the deformation and fracture of sapphire wafers subjected to thermal shocks
4. Effect of growth conditions on the strength of shaped sapphire
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