Utilizing the Cold Sintering Process for Flexible–Printable Electroceramic Device Fabrication-Reference-Cited by-同舟云学术

Utilizing the Cold Sintering Process for Flexible–Printable Electroceramic Device Fabrication

Published:2016-08-29 Issue:10 Volume:99 Page:3202-3204
ISSN:0002-7820
Container-title:Journal of the American Ceramic Society
language:en
Short-container-title:J. Am. Ceram. Soc.

Author:

Baker Amanda¹,Guo Hanzheng¹,Guo Jing¹,Randall Clive¹

Affiliation:

1. Department of Material Science and Engineering Center for Dielectrics and Piezoelectrics Material Research Institute The Pennsylvania State University University Park Pennsylvania 16802

Funder

National Science Foundation

Publisher

Wiley

Subject

Materials Chemistry,Ceramics and Composites

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1111/jace.14467

Reference18 articles.

1. “Flexible and Printed Electronics‐Market and Technology Report ” Available at:www.i-micronews.com/report/product/flexible-applications-based-on-printed-electronics-technologies.html. Yole Développement. Last accessed on May 2013.

2. Introduction to Printed Electronics

3. Printed electronics: the challenges involved in printing devices, interconnects, and contacts based on inorganic materials

4. Technologies for Printing Sensors and Electronics Over Large Flexible Substrates: A Review

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