High thermal conductivity silicon nitride ceramics prepared by pressureless sintering with ternary sintering additives-Reference-Cited by-同舟云学术

High thermal conductivity silicon nitride ceramics prepared by pressureless sintering with ternary sintering additives

Published:2019-03-13 Issue:4 Volume:16 Page:1399-1406
ISSN:1546-542X
Container-title:International Journal of Applied Ceramic Technology
language:en
Short-container-title:Int J Appl Ceram Technol

Author:

Duan Yusen¹²^ORCID,Zhang Jingxian¹³,Li Xiaoguang¹,Bai Hainan¹²,Sajgalik Pavol⁴,Jiang Dongliang¹

Affiliation:

1. State Key Laboratory of High Performance Ceramics and Superfine Microstructures, Shanghai Institute of Ceramics Chinese Academy of Sciences Shanghai China

2. University of the Chinese Academy of Sciences Beijing China

3. Suzhou Institute of SICCAS (Shanghai Institute of Ceramics, Chinese Academy of Sciences) Taicang Jiangsu Province China

4. Institute of Inorganic Chemistry Slovak Academy of Sciences Bratislava Slovakia

Funder

Ministry of Science and Technology of the People's Republic of China

National Natural Science Foundation of China

Chinese Academy of Sciences

Publisher

Wiley

Subject

Materials Chemistry,Marketing,Condensed Matter Physics,Ceramics and Composites

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1111/ijac.13220

Reference30 articles.

1. Textured silicon nitride: processing and anisotropic properties

2. Silicon Nitride and Related Materials

3. Effect of the addition of β-Si3N4 nuclei on the thermal conductivity of β-Si3N4 ceramics

4. Development of high-thermal-conductivity silicon nitride ceramics

5. Opportunities for Enhancing the Thermal Conductivities of SiC and Si3N4 Ceramics Through Improved Processing

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