Microstructure and stress relief mechanism of C/C composite and GH3044 superalloy joints using (Cu)+Ti5Si3 foil filler

Author:

Wang Yonglei1ORCID,Zhang Keke12,Yin Danqing1

Affiliation:

1. School of Materials Science and Engineering Henan University of Science and Technology Luoyang China

2. Provincial and Ministerial Co‐construction of Collaborative Innovation Center for Non‐ferrous Metal New Materials and Advanced Processing Technology Henan University of Science and Technology Luoyang China

Abstract

AbstractA Ti5Si3 reinforced (Cu) matrix foil composite filler was prepared and applied to join C/C composite and GH3044 superalloy, and a finite element model with random distribution particles was constructed to reveal the stress relief mechanism of composite brazing. Results showed the in‐situ synthesized Ti5Si3 reinforcements with a size of less than 5 µm were distributed uniformly in the (Cu) matrix, and their volume fraction reached 38%. The shear strength of the joint brazed with the composite filler reached 37.6 MPa, which is about 100% higher than that brazed with (Cu) filler. The Ti5Si3 reinforcements relieved the residual stress mainly by reducing residual stress values, introducing compressive stress into the joining layer, and transforming the continuous tensile stress into tensile stress/compressive stress.

Funder

National Natural Science Foundation of China

Publisher

Wiley

Subject

Materials Chemistry,Marketing,Condensed Matter Physics,Ceramics and Composites

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