Tape casting system for ULTCCs to fabricate multilayer and multimaterial 3D electronic packages with embedded electrodes

Author:

Chen Mei-Yu1,Vahera Timo1,Hsi Chi-Shiung2,Sobocinski Maciej1,Teirikangas Merja1,Peräntie Jani1,Juuti Jari1,Jantunen Heli1

Affiliation:

1. Microelectronics Research Unit; Faculty of Information Technology and Electrical Engineering; University of Oulu; Oulu Finland

2. Department of Material Science and Engineering; National United University; Miao-Li Taiwan

Publisher

Wiley

Subject

Materials Chemistry,Ceramics and Composites

Reference8 articles.

1. Low-loss dielectric ceramic materials and their properties;Sebastian;Int Mater Rev,2015

2. Low temperature co-fired ceramics with ultra-low sintering temperatures: a review;Sebastian;Curr Opin Solid State Mater Sci,2016

3. Ultra-low sintering temperature ceramics for LTCC applications: a review;Yu;J Mater Sci: Mater Electron,2015

4. Tape casting and dielectric properties of Zn2Te3O8-based ceramics with an ultra-low sintering temperature;Honkamo;Int J Appl Ceram Technol,2009

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