Tape casting system for ULTCCs to fabricate multilayer and multimaterial 3D electronic packages with embedded electrodes
Author:
Affiliation:
1. Microelectronics Research Unit; Faculty of Information Technology and Electrical Engineering; University of Oulu; Oulu Finland
2. Department of Material Science and Engineering; National United University; Miao-Li Taiwan
Publisher
Wiley
Subject
Materials Chemistry,Ceramics and Composites
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1111/jace.14639/fullpdf
Reference8 articles.
1. Low-loss dielectric ceramic materials and their properties;Sebastian;Int Mater Rev,2015
2. Low temperature co-fired ceramics with ultra-low sintering temperatures: a review;Sebastian;Curr Opin Solid State Mater Sci,2016
3. Ultra-low sintering temperature ceramics for LTCC applications: a review;Yu;J Mater Sci: Mater Electron,2015
4. Tape casting and dielectric properties of Zn2Te3O8-based ceramics with an ultra-low sintering temperature;Honkamo;Int J Appl Ceram Technol,2009
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