Fatigue crack initiation and growth in solder alloys
Author:
Publisher
Wiley
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1111/j.1460-2695.2006.01088.x/fullpdf
Reference41 articles.
1. Solder Joint Reliability
2. Fatigue of Materials
3. Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders
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