OBSERVING REAL-TIME THERMAL DEFORMATIONS IN ELECTRONIC PACKAGING
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials
Reference17 articles.
1. Moiré interferometry for engineering mechanics: Current practices and future developments
2. Transient thermal strain measurements in electronic packages
3. In situ calibration of stress chips
4. Thermal Strain Measurements in Electronic Packages Through Fractional Fringe Moire´ Interferometry
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