Dielectric properties analysis of dough and further microwave baking for cookies-Reference-Cited by-同舟云学术

Dielectric properties analysis of dough and further microwave baking for cookies

Published:2022-08-05 Issue:9 Volume:46 Page:
ISSN:0145-8892
Container-title:Journal of Food Processing and Preservation
language:en
Short-container-title:Food Processing Preservation

Author:

Gutiérrez‐Cárdenas Mónica Giovanna¹,Kaur Tejinder²,Corona‐Chávez Alonso³,Olvera‐Cervantes José Luis³^ORCID,Gómez‐Salazar Julián Andrés¹^ORCID,Rojas‐Laguna Roberto²^ORCID,Sosa‐Morales María Elena¹^ORCID

Affiliation:

1. Posgrado en Biociencias, Departamento de Alimentos, División de Ciencias de la Vida, Campus Irapuato‐Salamanca Universidad de Guanajuato Irapuato Mexico

2. Departamento de Ingeniería Electrónica, División de Ingenierías, Campus Irapuato‐Salamanca Universidad de Guanajuato Salamanca Mexico

3. Departamento de Electrónica Instituto Nacional de Astrofísica, Óptica y Electrónica Puebla Mexico

Funder

Consejo Nacional de Ciencia y Tecnología

Publisher

Hindawi Limited

Subject

General Chemical Engineering,General Chemistry,Food Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1111/jfpp.16940

Reference35 articles.

1. Dielectric properties of butter in the MW frequency range as affected by salt and temperature

2. Evaluating the role of microwave-baking and fennel (Foeniculum vulgare L.)/nigella (Nigella sativa L.) on acrylamide growth and antioxidants potential in biscuits

3. Dielectric properties of microwave-baked cake and its constituents over a frequency range of 0.915–2.450GHz

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