Jejunal Perforation for Biliary Stent Dislocation-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Jejunal Perforation for Biliary Stent Dislocation

Published:2006-04 Issue:4 Volume:101 Page:908-909
ISSN:0002-9270
Container-title:The American Journal of Gastroenterology
language:
Short-container-title:Am J Gastroenterol

Author:

Lanteri Raffaele,Naso Pietro,Rapisarda Cristian,Santangelo Marco,Cataldo Antonio Di,Licata Antonio

Publisher

Ovid Technologies (Wolters Kluwer Health)

Subject

Gastroenterology,Hepatology

Reference5 articles.

1. An unusual complication of a biliary stent–small bowel perforation of an incarcerated hernia sac

2. Biliary stent migration with colonic diverticular perforation

3. Incidence and risk factors for biliary and pancreatic stent migration

4. Clip closure of a duodenal perforation secondary to a biliary stent

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Late small bowel perforation from a migrated double plastic biliary stent: A case report and a review of literature of 85 cases from 2000 to 2022;Clinical Case Reports;2023-11

2. Sems Sensibility: Biliary Stent Migration into the Oesophagus;Digestive Diseases and Sciences;2023-10-27

3. Prótesis biliares migradas como causa de perforación doble del colon sigmoide;Revista Mexicana de Coloproctología Enfermedades del Ano, Recto y Colon;2023

4. Successful endoscopic closure with an over-the-scope clip for sigmoid colon perforation due to bile duct stent migration;Clinical Journal of Gastroenterology;2021-10-29

5. Small bowel perforation from a migrated biliary stent: A case report and review of literature;World Journal of Gastrointestinal Endoscopy;2021-10-16

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3