Affiliation:
1. School of Materials Science and Engineering Shanghai University Shanghai China
2. State Key Laboratory of High Performance Ceramics and Superfine Microstructures Shanghai Institute of Ceramics Chinese Academy of Sciences Shanghai China
3. Center of Materials Science and Optoelectronics Engineering University of Chinese Academy of Sciences Beijing China
Abstract
AbstractDigital light processing (DLP) three‐dimensional printing has the advantages of both high printing resolution and efficiency and has been used to manufacture high‐precision, small, and complex shaped ceramic parts. One of the challenges of DLP is to develop photosensitive ceramic slurries with high solid content and low viscosity, especially for non‐oxide ceramics such as silicon nitride due to the dispersion and light absorption problem. This study mainly explores the dispersibility of silicon nitride in ultraviolet (UV)‐cured resins and the photocured properties of the slurry. Rheological measurements were utilized to characterize and screen different dispersants in the resin. It was found that DISPERMP is an effective dispersant. In order to improve the curing depth of Si3N4 photosensitive paste, the surface of silicon nitride powder was treated by oxidation, and organic compounds with different refractive indices were also introduced to increase the light penetration depth. It was found that glycerol with a refractive index of 1.474 resulted in the greatest improvement in the curing depth of Si3N4 photosensitive paste. Finally, a proposed slurry composition was developed to successfully print silicon nitride ceramics through UV‐curing molding technology.
Funder
National Key Research and Development Program of China
National Natural Science Foundation of China
Science and Technology Commission of Shanghai Municipality
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