Improved Fracture Behavior of Alumina Microstructural Composites with Highly Textured Compressive Layers
Author:
Affiliation:
1. Department of Materials Science and Engineering; Pennsylvania State University; University Park Pennsylvania 16802
2. Institut für Struktur- und Funktionskeramik; Montanuniversität Leoben; Leoben Austria
Publisher
Wiley
Subject
Materials Chemistry,Ceramics and Composites
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1111/jace.13168/fullpdf
Reference37 articles.
1. Connectivity and Piezoelectric-Pyroelectric Composites;Newnham;Mater. Res. Bull.,1978
2. A Simple Way to Make Tough Ceramics;Clegg;Nature,1990
3. Debonding in Multilayered Composites of Zirconia and LaPO4;Marshall;J. Am. Ceram. Soc.,1997
4. Crack Deflection and Propagation in Layered Silicon Nitride/Boron Nitride Ceramics;Kovar;J. Am. Ceram. Soc.,1998
5. Fracture Behaviour of Alumina/Monzanite Multilayer Laminates;Mawdsley;J. Am. Ceram. Soc.,2000
Cited by 31 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Preparation and mechanical behavior of Si3N4 composite ceramics with brick‐and‐mortar structure;Journal of the American Ceramic Society;2023-12-26
2. Templated grain growth in rapid sintered 3D-printed alumina ceramics;Open Ceramics;2023-09
3. Mixed-mode fracture model to quantify local toughness in nacre-like alumina;Journal of the European Ceramic Society;2023-08
4. Micro-scale fracture toughness of textured alumina ceramics;Journal of the European Ceramic Society;2023-07
5. Absorption Capacity and Development of Photocatalyst Green Ceramic Products with Moderation of Green Environment for Sustainability Performance of Developing Industries;Sustainability;2022-08-23
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3