Cytokines, chemokines and growth factors in wound healing
Author:
Publisher
Wiley
Subject
Infectious Diseases,Dermatology
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1111/j.1468-3083.2011.04415.x/fullpdf
Reference83 articles.
1. Human skin wounds: a major and snowballing threat to public health and the economy;Sen;Wound Repair Regen,2009
2. Impaired wound healing;Menke;Clin Dermatol,2007
3. The burden of skin diseases: 2004 a joint project of the American Academy of Dermatology Association and the Society for Investigative Dermatology;Bickers;J Am Acad Dermatol,2006
4. The extracellular matrix: not just pretty fibrils;Hynes;Science,2009
5. Cross talk among TGF-{beta} signaling pathways, integrins, and the extracellular matrix;Munger;Cold Spring Harb Perspect Biol,2011
Cited by 324 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Emerging biomedical technologies for scarless wound healing;Bioactive Materials;2024-12
2. Comparing Line‐Field Confocal Optical Coherence Tomography and Reflectance Confocal Microscopy on the In Vivo Healing Process of Lesions Induced by Fractional Photothermolysis;Lasers in Surgery and Medicine;2024-09-08
3. GelMA loaded with exosomes from human minor salivary gland organoids enhances wound healing by inducing macrophage polarization;Journal of Nanobiotechnology;2024-09-06
4. Chitosan based extruded nanofibrous bioscaffold for local delivery of mesenchymal stem cells to improve diabetic wound healing;Stem Cell Research & Therapy;2024-08-15
5. Advances, challenges, and future directions in the clinical translation of ECM biomaterials for regenerative medicine applications;Advanced Drug Delivery Reviews;2024-08
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3