1. Residual Stresses in Meta/Ceramic Bonded Strips
2. 2C. H. Hsueh, and A. G. Evans , "On Residual Stresses and Cracking in Metal/Ceramic Systems for Microelectronics Packaging" pp. 24282 in Mechanical Aspects of " Interfaces and Surfaces in Ceramic Containing Systems, Annual Report to Office of Naval Research under Contract No. N0001481K0362, Department of Materials Science and Mineral Engineering, University of California, Berkeley, Dec. 31, 1984 .
3. The stress analysis of multi-layered composites with a flaw