Thermally Induced Failure of Copper-Bonded Alumina Substrates for Electronic Packaging
Author:
Publisher
Wiley
Subject
Materials Chemistry,Ceramics and Composites
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1111/j.1151-2916.1992.tb04433.x/fullpdf
Reference14 articles.
1. Role of Oxygen in Bonding Copper to Alumina
2. Interface Structure and Bond Strength of Copper-Bonded Alumina Substrates
3. Experimental Observations of Substrate Fracture Caused by Residually Stressed Films
4. 4T. Yoshida , "New Engineering Review of Coating "; 429 34 . Industrial Technology Service Center, Tokyo, Japan, 1987 .
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