Author:
Lazaroff Jerold E.,Ownby P. Darrell,Weirauch Douglas A.
Subject
Materials Chemistry,Ceramics and Composites
Reference52 articles.
1. 1. D. P. Seraphim, R. C. Lasky, and C.Y. Li ), Principles of Electronic Packaging ; pp. 1 -15 . McGraw-Hill, New York, 1989 .
2. Microelectronics Packaging — An Overview
Cited by
11 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献