Symposium on Thermal Fracture*. Recommended Letter Symbols for Thermal Stress Analysis+-Reference-Cited by-同舟云学术

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Symposium on Thermal Fracture*. Recommended Letter Symbols for Thermal Stress Analysis+

Published:1955-01 Issue:1 Volume:38 Page:1-2
ISSN:0002-7820
Container-title:Journal of the American Ceramic Society
language:en
Short-container-title:J American Ceramic Society

Author:

KINGERY W. D.

Publisher

Wiley

Subject

Materials Chemistry,Ceramics and Composites

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1111/j.1151-2916.1955.tb14544.x/fullpdf

Cited by 29 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mechanical and thermal properties of RETaO4 (RE = Yb, Lu, Sc) ceramics with monoclinic-prime phase;Journal of Materials Science & Technology;2020-09

2. Effect of alumina bubbles with and without Al 2 O 3 coatings on the performance of lightweight Al 2 O 3 ‐MgAl 2 O 4 refractories;International Journal of Applied Ceramic Technology;2020-07-24

3. Effect of thermal conductivity of ceramic compact on the porous structures of foamed bodies via direct-foaming method;Journal of Asian Ceramic Societies;2020-01-02

4. Thermal shock resistance of sodalime glass eroded by sandblasting;Glass Structures & Engineering;2019-11-14

5. High‐temperature mechanical and thermal properties of Ca 1− x Sr x ZrO 3 solid solutions;Journal of the American Ceramic Society;2019-11

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