Cofiring Kinetics and Mechanisms of an Ag-Metallized Ceramic-Filled Glass Electronic Package-Reference-Cited by-同舟云学术

Cofiring Kinetics and Mechanisms of an Ag-Metallized Ceramic-Filled Glass Electronic Package

Published:2005-01-21 Issue:12 Volume:80 Page:3084-3092
ISSN:0002-7820
Container-title:Journal of the American Ceramic Society
language:en
Short-container-title:

Author:

Jean Jau-Ho,Chang Chia-Ruey

Publisher

Wiley

Subject

Materials Chemistry,Ceramics and Composites

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1111/j.1151-2916.1997.tb03236.x/fullpdf

Reference35 articles.

1. A. H. Kumar P. W. McMillan R. R. Tummala Glass-Ceramic Structures and Sintered Multilayered Substrates Thereof with Circuit Patterns of Gold, Silver, or Copper 1981

2. Ceramic and Glass-Ceramic Packaging in the 1990s;Tummala;J. Am. Ceram. Soc.,1991

3. Cordierite Glass-Ceramics for Ceramic Packaging;Knickerbocker;Am. Ceram. Soc. Bull.,1993

4. Influence of Shrinkage Mismatch between Copper and Ceramics on Dimensional Control of the Multilayer Ceramic Circuit Board;Imanaka;J. Ceram. Soc. Jpn. Int. Ed.,1992

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