Residual Stress in a Soft-Buffer-Inserted Metal/Ceramic Joint-Reference-Cited by-同舟云学术

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Residual Stress in a Soft-Buffer-Inserted Metal/Ceramic Joint

Published:1990-11 Issue:11 Volume:73 Page:3462-3465
ISSN:0002-7820
Container-title:Journal of the American Ceramic Society
language:en
Short-container-title:J American Ceramic Society

Author:

Xian Ai-Ping,Si Zhong-Yao

Publisher

Wiley

Subject

Materials Chemistry,Ceramics and Composites

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1111/j.1151-2916.1990.tb06476.x/fullpdf

Reference12 articles.

1. The Plane Solution for Joined Dissimilar Elastic Semistrips Under Tension

2. 5K. H. Thiemann, H. J. Weinert, and W. Rauchle , "Soldering Foil Joining of Ceramic Bodies to Metal," GB Pat. No. 2151173A, 1985 .

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