Microstructural evolution during thermal shock process and the residual strength of Si <sub>3</sub> N <sub>4</sub> ceramics-Reference-Cited by-同舟云学术

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Microstructural evolution during thermal shock process and the residual strength of Si ₃ N ₄ ceramics

Published:2022-08-04 Issue:6 Volume:19 Page:3410-3419
ISSN:1546-542X
Container-title:International Journal of Applied Ceramic Technology
language:en
Short-container-title:Int J Applied Ceramic Tech

Author:

Yang Xiao¹^ORCID,Liu Xuejian¹,Zhang Hui¹,Huang Zhengren¹

Affiliation:

1. State Key Laboratory Shanghai Institute of Ceramics Chinese Academy of Sciences Shanghai China

Funder

Science and Technology Commission of Shanghai Municipality

National Natural Science Foundation of China

Publisher

Wiley

Subject

Materials Chemistry,Marketing,Condensed Matter Physics,Ceramics and Composites

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1111/ijac.14125

Reference29 articles.

1. Fabrication, thermal shock resistance, and dielectric property of α‐Si 3 N 4 ‐based ceramic coating on porous Si 3 N 4 ceramics

2. New route to improve the fracture toughness and flexural strength of Si3N4 ceramics by adding FeSi2

3. Toughening of silicon nitride ceramics by addition of multilayer graphene

4. Effect of metal phases on microstructure and mechanical properties of Si3N4-based ceramic tool materials by microwave sintering

5. Numerical model for the cracking behavior of heterogeneous brittle solids subjected to thermal shock

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1. Effect of micro-hole shape and arrangement on the impact properties of three-dimensional isotropic brittle structures;Theoretical and Applied Fracture Mechanics;2023-06

2. Micro-holes’ effect on energy absorption ability in three-dimensional brittle materials under impact loading: A preliminary research;Structures;2023-06

3. Simulation of the Propagation Speed of Prefabricated Crack in Ceramic Sample Under Flame Thermal Shock by the Phase-Field Method;2023

4. Simulation of the Propagation Speed of Prefabricated Crack in Ceramic Sample Under Flame Thermal Shock by the Phase-Field Method;2023

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