Joining of aluminum and ceramic substrates by interposing molten aluminum–silicon alloy-Reference-Cited by-同舟云学术

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Joining of aluminum and ceramic substrates by interposing molten aluminum–silicon alloy

Published:2022-09-06 Issue:2 Volume:20 Page:995-1001
ISSN:1546-542X
Container-title:International Journal of Applied Ceramic Technology
language:en
Short-container-title:Int J Applied Ceramic Tech

Author:

Kita Ken'ichiro¹^ORCID,Hotta Mikinori¹

Affiliation:

1. Multi‐Material Research Institute National Institute of Advanced Industrial Science and Technology (AIST) Nagoya Japan

Publisher

Wiley

Subject

Materials Chemistry,Marketing,Condensed Matter Physics,Ceramics and Composites

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1111/ijac.14198

Reference14 articles.

1. Joining of Ceramics and Metals

2. Tensile fracture characterization of braze joined copper-to-CFC coupon assemblies

3. Progress in joining of advanced materials

4. Effect of residual stress on the strength of an alumina–steel joint by partial transient liquid phase (PTLP) brazing

5. Metal to ceramic joining via a metallic interlayer bonding technique

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of β-Si3N4 Seeds on Microstructure and Performance of Si3N4 Ceramics in Semiconductor Package;Materials;2023-06-19

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