Effect of Aluminum Content on Mechanical Properties and Thermal Conductivities of Sintered Reaction-Bonded Silicon Nitride-Reference-Cited by-同舟云学术

Effect of Aluminum Content on Mechanical Properties and Thermal Conductivities of Sintered Reaction-Bonded Silicon Nitride

Author:

Kusano Dai¹²³,Hyuga Hideki²,Zhou You²,Hirao Kiyoshi¹²

Affiliation:

1. Department of Frontier Materials; Nagoya Institute of Technology; Gokiso-cho, Showa-ku Nagoya Aichi 466-8555 Japan

2. National Institute of Advanced Industrial Science and Technology (AIST); 2266-98 Shimo-Shidami Nagoya 463-8560 Japan

3. Japan Fine Ceramics Co., Ltd.; 3-10 Akedori Sendai 981-3203 Japan

Publisher

Wiley

Subject

Materials Chemistry,Marketing,Condensed Matter Physics,Ceramics and Composites

Reference27 articles.

1. Opportunities for Enhancing the Thermal Conductivity of SiC and Si3N4 Ceramics Through Improved Processing;Haggerty;Ceram. Eng. Sci. Proc.,1995

3. Molecular Dynamics Calculation of the Ideal Thermal Conductivity of Single-Crystal α- and β-Si3N4;Hirosaki;Phys. Rev.,2002

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