Mechanical properties and microstructure evolution of KD‐SA SiCf/BN/SiC CMCs oxidized at different temperatures

Author:

Li Liuwei1,Qin Hao23ORCID,Liao Chunjing23,You Xiao23ORCID,Luo Han23,Xue Yudong23,Yue Xuezheng1,Yang Jinshan23ORCID,Zhang Xiangyu23,Dong Shaoming234

Affiliation:

1. School of Materials Science and Engineering University of Shanghai for Science and Technology Shanghai China

2. State Key Laboratory of High Performance Ceramics and Superfine Microstructure Shanghai Institute of Ceramics, Chinese Academy of Sciences Shanghai China

3. Structural Ceramics and Composites Engineering Research Center Shanghai Institute of Ceramics, Chinese Academy of Sciences Shanghai China

4. Center of Materials Science and Optoelectronics Engineering University of Chinese Academy of Sciences Beijing China

Abstract

AbstractSilicon carbide fiber‐reinforced SiC ceramic matrix composites (SiCf/SiC CMCs) based on a domestic KD‐SA SiC fiber were exposed to a wet oxygen atmosphere for 135 h at 800, 1100, and 1300°C. The evolution of the microstructure and mechanical properties of SiCf/SiC CMCs have been systematically investigated following oxidation. For weight change, CMC‐1300 showed the greatest gain (0.394%), followed by CMC‐1100 (0.356%) and CMC‐800 (0.149%). The volatilization of boron oxide (B2O3) combined with the slight oxidation of the SiC matrix at 800°C caused crack deflection and fiber pull‐out. The complete dissipation of the interphase could be found when the oxidation temperature increases to 1100°C, generated a fracture surface with brittle fracture characteristics. At 1300°C, crystalline SiO2 hindered oxygen diffusion, with evidence of fiber pull‐out. Based on thermodynamic calculations and microscopic observations, we propose a mechanism to explain the thermal degradation of SiCf/SiC CMCs. This work offers valuable guidance for the fabrication of SiCf/SiC CMCs that are suitable for high‐temperature applications.

Funder

National Key Research and Development Program of China

National University of Defense Technology

Publisher

Wiley

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