Metal-Bonding-Based Hermetic Wafer-Level MEMS Packaging Technology Using In-Plane Feedthrough
Author:
Affiliation:
1. Micro System Integration Center, Tohoku University
2. Graduate School of Engineering, Tohoku University
Publisher
Institute of Electrical Engineers of Japan (IEE Japan)
Subject
Electrical and Electronic Engineering,Mechanical Engineering
Link
https://www.jstage.jst.go.jp/article/ieejsmas/138/10/138_485/_pdf
Reference33 articles.
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3. (3) Z. Wang : “3-D Integration and Through-Silicon Vias in MEMS and Microsensors”, J. Microelectromech. Syst., Vol. 24, No. 5, pp. 1211-1244 (2015)
4. (4) R. R. Benoit, R. Q. Rudy, J. S. Pulskamp, R. G. Polcawich, and S. S. Bedair : “Advances in piezoelectric PZT-based RF MEMS components and systems”, J. Micromech. Microeng., Vol. 27, No. 8, 083002 (2017)
5. (6) X. Zhang, A. Zeshan, O. J. Adelegan, F. Y. Yamaner, and O. Oralkan : “A MEMS T/R Switch Embedded in CMUT Structure for Ultrasound Imaging Frontends”, Proc. IEEE International Ultrasonics Symposium (2016)
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