Sensitivity Modification of Piezoelectric Diaphragm-Type Ultrasonic Microsensors by Poling and Influence of in-Plane Stress-Reference-Cited by-同舟云学术

Sensitivity Modification of Piezoelectric Diaphragm-Type Ultrasonic Microsensors by Poling and Influence of in-Plane Stress

Published:2014 Issue:5 Volume:134 Page:119-124
ISSN:1341-8939
Container-title:IEEJ Transactions on Sensors and Micromachines
language:en
Short-container-title:IEEJ Trans. SM

Author:

Yamashita Kaoru¹,Tanaka Hikaru¹,Morimoto Atsushi¹,Yang Yi¹,Noda Minoru¹

Affiliation:

1. Kyoto Institute of Technology

Publisher

Institute of Electrical Engineers of Japan (IEE Japan)

Subject

Electrical and Electronic Engineering,Mechanical Engineering

Link

https://www.jstage.jst.go.jp/article/ieejsmas/134/5/134_119/_pdf

Reference13 articles.

1. (1) J. T. Bernstein, S. L. Finberg, K. Houston, L. C. Niles, H. D. Chen, L. E. Cross, K. K. Lee, and K. Udayakumar: “Micromachined High Frequency Ferroelectric Sonar Transducers”, IEEE Trans. Utrrason. Ferro. Freq. Cont. Vol.44 pp. 960-969 (1997)

2. (2) P. Muralt, D. Schmitt, N. Ledermann, J. Baborowski, P. K. Weber, W. Steichen, S. Petitgrand, A. Bosseboeuf, N. Setter, and P. Gaucher: “Study of PZT Coated Membrane Structures for Micromachined Ultrasonic Transducers”, IEEE Ultrason. Symp., pp.907-911, New York, USA (2001-10)

3. (3) K. Yamashita, H. Katata, M. Okuyama, H.Miyoshi, G. Kato, S. Aoyagi, and Y. Suzuki: “Arrayed ultrasonic microsensors with high directivity for in-air use using PZT thin film on silicon diaphragms”, Sensors and Actuators A, Vol.97-98, pp.302-307 (2002)

4. (4) D. Akai, T. Yogi, I. Kamja, Y. Numata, K. Ozaki, K. Sawada, N. Okada, K. Higuchi, and M. Ishida: “Miniature Ultrasound Acoustic Imaging Devices Using 2-D pMUTs Array on Epitaxial PZT/SrRuO₃/Pt/γ-Al₂O₃/Si Structure”, Transducers 2011, pp.910-913, Beijing, China (2011-6)

5. (5) K. Yamashita, Y. Yang, H. Tanaka, and M. Noda: “Multiple-Frequency Design for High Performance Ultrasonic Measurement by Using Phased Array with Reduced Number of Sensor Element”, The 12th International Conference on Emerging Trend in Engineering and Technology (ICETET 2012), pp.137-142, Himeji, Japan (2012-11)