Particle Removal without Causing Damage to MEMS Structure-Reference-Cited by-同舟云学术

Particle Removal without Causing Damage to MEMS Structure

Published:2013 Issue:5 Volume:133 Page:157-163
ISSN:1341-8939
Container-title:IEEJ Transactions on Sensors and Micromachines
language:en
Short-container-title:IEEJ Trans. SM

Author:

Hirano Hideki¹,Rasly Mahmoud¹,Kaushik Neelam²,Esashi Masayoshi²,Tanaka Shuji¹

Affiliation:

1. Graduate school of Engineering, Tohoku University

2. WPI-AIMR, Tohoku University

Publisher

Institute of Electrical Engineers of Japan (IEE Japan)

Subject

Electrical and Electronic Engineering,Mechanical Engineering

Link

https://www.jstage.jst.go.jp/article/ieejsmas/133/5/133_157/_pdf

Reference12 articles.

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2. (2) S. Tanaka and M. Esashi : “Wafer-level heterointegration technologies for MEMS-based communication”, Smart Systems Integration, Como, Italy, 23-24 March (2010)

3. (3) G. Vereecke, F. Holsteyns, S Arnauts, S .Beckx, P. Jaenen, K. Kenis, M. Lismont, M. Lux, R. Vos, J. Snow, and P. W. Mertens : “Evaluation of megasonic cleaning for sub-90-nm technologies”, Solid State Phenomena, Vol. 103-104, pp. 141-146 (2005)

4. (4) A. Eitoku, J. Snow, R. Vos, M. Sato, S. Hirae, K. Nakajima, M. Nonomura, M. Imai, P. W. Mertens, and M. M. Heyns : “Removal of small (< 100-nm) particles and metal contamination in single-wafer cleaning tool”, Solid State Phenomena, Vol. 92, pp. 157-160 (2003)

5. (5) T Hattori : “Non-Aqueous/Dry Cleaning Technology without Causing Damage to Fragile Nano-Structures”, ECS Transactions, Vol. 25, No. 5, pp. 3-14 (2009)

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