Fabricating Process of Thin-Strain Sensor by Utilizing Wafer-Level-Packaging Techniques
Author:
Affiliation:
1. Reliability Science Research Department, Production Engineering and MONOZUKURI Innovation Center, Research & Development Group, Hitachi, Ltd.
Publisher
Institute of Electrical Engineers of Japan (IEE Japan)
Link
https://www.jstage.jst.go.jp/article/ieejsmas/144/4/144_56/_pdf
Reference25 articles.
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2. (2) A. S. Fiorillo, C. D. Critello, and S. A. Pullano : “Theory, technology and applications of piezoresistive sensors: A review”, Sensors and Actuators A: Physical, Vol. 281, pp. 156-175 (2018)
3. (3) M. Esashi : “Wafer level packaging of MEMS”, J.Micromech. microeng., Vol. 18, No. 7, 073001 (2008)
4. (4) Z. Gong, Y. Zhang, X. Guo, and Z. Liu : “Wafer-Level Packaging Method for RF MEMS Applications Using Pre-Patterned BCB Polymer”, Micromachines, 9, 93 (2018)
5. (5) H. Takagi and R. Maeda : “Aligned room-temperature bonding of silicon wafers in vacuum by argon beam surface activation”, J. Micromech. Microeng., 15, No. 2, pp. 290-295 (2005)
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